Processing method as below is upon your quantity and precision.
Not only
the following
processing, but also die blanking, laser processor and turret punch press are achieved.
A free sample is made when it comes to confirmation of section or finish.
| Method | Etching | Wire (φ0.05) | Microscopic laser |
|---|---|---|---|
| Thickness | ~0.5 | ~40.0 | 0.03~(1.0) |
| Processing range | A4 size | 200×300 | 500×500 |
| Precision | ±10~15% of the thickness or more than ±0.03 |
±0.01~ | ±0.03~ |
| Inside radius of the corner | Radius the thickness | R0.04~0.2 (It depends on diameter of wire ) |
R0.05~ (about 0.06) |
| Minimum slit | Around thickness | 0.15~0.3 (It depends on diameter of wire ) |
0.1 (It depends on thickness.) |
| Points | ・Minimum effect on
discoloration ・Limit the shape |
・Doubt of discoloration and rust ・Hole needed before threading High-precision |
・Achieve to process with nonferrous metal like phosphor bronze, aluminum and plating material (except pure copper) |
| Limitation | ・
Disapprovement
of material in plating ・Need sufficient lead-times |
・Clean by acid ・Dent |
・Discoloration, burrs |
| Suitable amounts | Middle amounts | Small amounts | From small to middle amounts |
| Costs | ・Need plating costs | ・No initial cost ・Need sufficient processing times |
・No initial cost ・Agility in a short lead-times |
| Delivery | In a week | In 1 or 1.5 weeks | In 1 or 2 days |
| The number of facilities | Cooperated companies | 1 | 3 in SAIJO group |
| The section | |||
| The finished shape | ![]() |
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