Electronic Components Ⅳ

A Metal Parts List

Note・・・1：Material,2：Finish,3：Processing
image193.jpg
  1. C1100-1/2H t=0.8
  2. -
  3. (blank) Wire EDM
    (bending) Simple die + Standard die
 image205.jpg
  1. C2680-1/2H　t=1.0
  2. -
  3. (blank)Die (blanking)
    (bending) Simple die
 image203.jpg
  1. C5210-H　ｔ=0.15
    C2680-H　t=0.5
  2. Cu-Ni plating (only for copper)
  3. (blank)Die (blanking)
    (bending) Simple die, Caulking
 image201.jpg
  1. C2680-1/2H　t=0.8
  2. -
  3. (blank) Die (blanking)
    (bending) Simple die
image211.jpg
  1. C5210-H　t=0.2
  2. Cu-Ni plating (Plating ahead)
  3. (blank) Etching
    (blank) Die (blanking)
 image223.jpg
  1. C2680-H　t=0.4
  2. -
  3. (blank)Die (blanking)
    (bending) Simple die + Standard die
 image219.jpg
  1. C1020-1/2H　t=1.0
  2. -
  3. (blank) Wire EDM
    (bending) Simple die
 image199.jpg
  1. C5191-1/2H　t=0.8
  2. Cu-Sn plating (plating ahead)
  3. (blank) Die blanking
    (bending) Simple die
image189.jpg
  1. C2680-H　t=0.4
  2. Cu-Sn plating (post-plating)
  3. (blank) Wire EDM
    (bending) Simple die
 image191.jpg
  1. C5210-H　t=0.1
  2. -
  3. (blank) Etching
    (bending) Simple die
 image197.jpg
  1. C5191-H　t=0.15
  2. Ni-Au (plating ahead)
  3. (blank) Etching + Plating
    (bending) Simple die
 image195.jpg
  1. C5191-H　t=0.2
  2. Cu-Ni plating (post-plating)
  3. (blank) Etching
    (bending) Simple die + Standard die
image215.jpg
  1. SPCC-SD　t=0.8
  2. Cu-Ni plating (post-plating)
  3. (blank) Microscopic Laser Processor
    (bending) Simple die
 image213.jpg
  1. C5191-H　t=0.4
  2. -
  3. (blank) Wire EDM
    (bending) Simple die
 image209.jpg
  1. C5191-H　t=0.15
  2. Cu-Sn plating (plating ahead)
  3. (blank) Etching + Plating
    (bending) Simple die
 image221.jpg
  1. C5191-H　t=0.15
  2. Cu-Ag plating (plating ahead)
  3. (blank) Etching
    (drawing）Simple die
image229.jpg
  1. C7521-1/2H　t=0.1
  2. -
  3. (blank) Microscopic Laser Processor
    (bending)Simple die
 image225.jpg
  1. C7521-1/2H　t=0.15
  2. -
  3. (blank) Microscopic Laser Processor
    (bending)Simple die
 image233.jpg
  1. C5191-H　t=0.15
  2. -
  3. (blank) Microscopic Laser Processor
    (bending) Simple die
 image227.jpg
  1. C2680-H　t=0.5
  2. Sn-Re plating (plating ahead)
  3. (blank) Microscopic Laser Processor
    (bending) Simple die + Standard die
image217.jpg
  1. C2680-H　t=0.15
  2. -
  3. (blank) Wire EDM
    (bending) Simple die
      

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The Samples of Metal/Resin sets

Metal Part Ⅰ
Electronic ComponentsⅠ: Metal
Connectors, Relays, Switches, Motors, Antennas, etc.
Resin Parts Ⅱ
Electronic ComponentsⅡ: Resin
Housing, Base, Connectors, Switches, etc.
Metal Part Ⅲ
Electronic ComponentsⅢ
Lead Frames, Backlights, Power Modules, etc.
Metal Parts Ⅳ
Electronic ComponentsⅣ
Covers, Shield Cases, etc.
Drawing Processing
Drawing Parts
Circular Drawing, Square Drawing, Complex shaped Drawing, etc.
Mechanical Components
Various Mechanical Parts
Vehicle Components, Industrial Machine Parts, etc.
  • What’s the our KNOW-HOW?

The Examples of Difficult Processing Products

Making Fins by Stamping
Fin Stamping
Offset Fins, Corrugated Fins, etc.
The Change of Method
No More Die Casting
Low-Costs, Weight-saving,etc.
Original Deep Drawing
One-shot Deep Drawing

Suitable for a Need of Strength,etc.

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