- LCP
- C5210-H t=0.64
Sn-Re plating (plating ahead)
- (molding) Simple die
(blank) Die blanking
(bending) Simple die, Assembly
|
- LCP
- C5210-H t=0.15
Ni-Au plating (post-plating)
- (molding) Die-set
(blank) Simple progressive, Assembly
|
- PA
- -
- (molding) Simple die
|
- LCP
- -
- (molding) Simple die
|
- LCP
- -
- (molding) Simple die
|
- LCP
- -
- (molding) Simple die
|
- LCP
- -
- (molding) Simple die
|
- LCP
- -
- (molding) Simple die
|
- PBT
- -
- (molding) Simple die
|
- LCP
- -
- (molding) Simple die
|
- LCP
- -
- (molding) Simple die
|
- PBT
- -
- (molding) Simple die
|
- ABS
- C7521-1/2H t=0.15
Partial Au plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Die (blanking)
(bending) Simple die + Standard die
|
- ABS
- -
- (molding) Simple die
|
- PBT
- KFC-H t=0.4
Cu-Ag plating (post-plating)
- (molding) Die-set & Insert molding
(blank) Die (blanking)
(bending) Simple die + Standard die
|
- LCP
- SUS304-2B t=0.2
Partial Au plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Die (blanking)
(bending) Simple die + Standard die
|
- LCP
- C2680-H t=0.3
Cu-Au plating (post-plating)
- (molding) Die-set & Insert molding
(blank) Etching
(bending) Simple die
|
- LCP
- C2680-H t=0.15
Cu-Au plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Etching + Plating
(bending) Simple die
|
- LCP
- C2680-H t=0.15
Cu-Au plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Etching + Plating
(bending) Simple die
|
- PBT
- C2680-H t=0.15
Cu-Au plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Etching + Plating
(bending) Simple die + Standard die
|
- LCP
- C5210-H t=0.2
Ni-Sn plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Etching + Plating
(bending) Simple die
|
- LCP
- C2680-H t=0.15
Cu-Au plating (post-plating)
- (molding) Die-set & Insert molding
(blank) Etching
(bending) Simple die
|
- LCP
- KFC-H t=0.4
Cu-Ag plating (post-plating)
- (molding) Die-set & Insert molding
(blank) Etching
(bending) Simple die
|
- LCP
- C2680-H t=0.15
Cu-Ag plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Die (blanking) (bending) Simple die
|
- LCP
- C2680-H t=0.2
Cu-Ag plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Die (blanking)
(bending) Simple die
|
- PBT
- C2680-H t=0.4
- Cu-Ag plating (plating ahead) (molding) Die-set & Insert molding
(blank) Die (blanking)
(bending) Simple die
|
- PBT
- C2680-H t=0.5
Cu-Ag plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Etching + Plating
(bending) Simple die
|
- LCD
- C2680-H t=0.3
Cu-Ag plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Etching + Plating
(bending) Simple die
|
- PBT
- C5191-H t=0.2
Cu-Ag plating (plating ahead)
- (molding) Die-set & Insert molding
(blank) Die (blanking)
(bending) Simple die + Standard die
|
- LCP
- -
- (molding) Die-set
|
|
|