Electronic Components Ⅰ: Metal

A Metal Parts List

Note・・・1：Material, 2：Finish, 3：Processing
image013.jpg
  1. C5191-H　t=0.3
  2. Ni-Sn plating (post-plating)
  3. (blank) Etching
    (bending) Simple die + Standard die

 

 Under construction ・・・

 

 image045.jpg
  1. C5191-H　t=0.2 
  2. Ni-Sn plating (post-plating)
  3. (blank) Microscopic Laser Processor
    (bending) Simple die
 image035.jpg
  1. SUS304CSP-3/4H　t=0.2
  2. - 
  3. (blank) Microscopic Laser Processor
    (bending) Simple die + Standard die
image017.jpg
  1. SUS304CSP-H　t=0.2 
  2. -
  3. (blank) Die blanking
    (bending) Simple die
 image011.jpg
  1. SUS304CSP-1/2H　t=0.25
  2. -
  3. (blank) Microscopic Laser Processor
    (bending) Simple die + Standard die
 image027.jpg
  1. C5191-H　t=0.2
  2. Ni-Sn plating (Post-plating)
  3. (blank) Etching
    (bending) Simple die + Standard die
 image001.jpg
  1. SUS304CSP-3/4H　t=0.3
  2. -
  3. (blank) Die blanking
image003.jpg
  1. SUS304CSP-3/4H　t=0.3
  2. -
  3. (blank) Die blanking
    (bending) Simple die
 image033.jpg
  1. C5191-H　t=0.2
  2. Ni-Sn plating (post-plating)
  3. (blank) Microscopic Laser Processor
    (bending) Simple die
 image015.jpg
  1. C5191-H　t=0.15
  2. Sn-Re plating (plating ahead)
  3. (blank) Die blanking
    (bending) Simple die
 image019.jpg
  1. C5191-H　t=0.2
  2. Sn-Re plating (plating ahead)
  3. (blank) Wire EDM
    (bending) Simple die
image041.jpg
  1. C2680-H　t=0.15 
  2. - 
  3. (blank) Wire EDM
    (bending) Simple die
 image037.jpg
  1. C5210-H　t=0.25
  2. Cu-Sn plating (post-plating)
  3. (blank）Etching
    (bending）Simple die
image049.jpg
  1. C2680-H　t=0.3
  2. Sn-Re plating (plating ahead)
  3. (blank) Wire EDM
    (bending) Simple die
 image047.jpg
  1. C5191-H　t=0.15
  2. Ni-Au plating (post-plating)
  3. (blank）Die blanking
    (bending）Simple die
image005.jpg
  1. C2680-H　t=0.3
  2. Sn-Re plating (plating ahead)
  3. (blank) Wire EDM
    (bending) Simple die
 image007.jpg
  1.  C5191-H　t=0.3
  2. Sn-Re plating (plating ahead)
  3. (blank) Wire EDM
    (bending) Simple die
 image029.jpg
  1. C5210-H　t=0.15
  2. Sn-Re plating (plating ahead)
  3. (blank) Wire EDM
    (bending) Simple die
 image009.jpg
  1.  C5210-H　t=0.2
  2. - 
  3. (blank) Wire EDM
    (bending) Simple die +Standard die
image023.jpg
  1. C5210-H　t=0.15
  2. Ni-Au (partial plating/post-plating)
  3. Simple progressive
    (blank corner R0.2)
 image039.jpg
  1. SUS304CSP-3/4H　t=0.2
  2. - 
  3. (blank）Etching
    (bending）Simple die + Standard die

image025.jpg

  1. C5210-H　t=0.15
  2. Ni-Au (post-plating)
  3. (blank) Microscopic Laser Processor
    (bending）Simple die + Standard die
 image039.jpg
  1. C5210-H　t=0.15
  2. Ni-Au (post-plating)
  3. (blank) Wire EDM
    (bending）Simple die
image043.jpg
  1. C5210-H　t=0.15
  2. Ni-Au (post-plating)
  3. (blank) Wire EDM
    (bending) Simple die
 image031.jpg
  1. Ycut-M-H　t=0.3
  2. Cu-Ag plating (post-plating)
  3. (blank) Etching
    (bending) Simple die + Standard die
 image053.jpg
  1. C5210-H　t=0.15
  2. Ni-Au (post-plating)
  3. Simple progressive
 image055.jpg
  1. SUS304CSP-H　t=0.2
  2. -
  3. (blank) Etching
    (bending) Simple die
image087.jpg
  1. SUS301CSP-EH　t=0.15
  2. - 
  3. (blank) Die(blanking)
    (bending) Simple die

 image089.jpg
  1. SUS301CSP-H　t=0.08
  2. - 
  3. (blank) Etching
    (bending) Simple die
 image077.jpg
  1. SUS301CSP-H　t=0.08
  2. Cu-Ag Plating (Plating ahead)
  3. (blank) Etching
    (bending) Simple die + Standard die
 image067.jpg
  1. SUS301CSP-H　t=0.1 
  2. -
  3. (blank) Etching
    (bending) Simple die + Standard die
image069.jpg
  1. Ycut-M-H　t=0.15
  2. Cu-Sn Plating (post-plating)
  3. (blank) Etching
    (bending) Simple die
 image071.jpg
  1. C5210-H　t=0.1
  2. Cu-Ag Plating (plating ahead)
  3. (blank) Etching
    (bending) Simple die + Standard die
 image073.jpg
  1. SUS301CSP-H　t=0.15
  2. - 
  3. (blank) Die (blanking)
    (bending) Simple die
 image083.jpg
  1. SUS304CSP-H　t=0.15
  2. - 
  3. (blank) Die (blanking)
    (bending) Simple die
image075.jpg
  1. SUS304CSP-H　t=0.2
  2. - 
  3. (blank) Microscopic Laser Processor
    (bending) Simple die + Standard die
 image085.jpg
  1. C1720-HM-H　t=0.07
  2. - 
  3. (blank) Die blanking
    (bending) Simple die
 image095.jpg
  1. C5210-H　t=0.15
  2. -
  3. (blank) Die blanking
    (bending) Simple die, Caulking
 image101.jpg
  1. KFC-1/2H　t=0.4
  2. Cu-Ag Plating (post-plating)
  3. (blank) Die blanking
    (bending) Simple die + Standard die
image061.jpg
  1. C2680-H　t=0.5
    SUS301CSP-H　t=0.05
  2. Ni-Ag plating (only for stainless steel)
  3. (blank) Etching
    (bending) Simple die, Caulking
image065.jpg
  1. C5191-H　t=0.15 
  2. Cu-Ag plating (plating ahead)
  3. (blank) Etching
    (bending) Simple die
 image079.jpg
  1. C5191-H　t=0.2 
  2. Cu-Sn plating (plating ahead)
  3. (blank) Etching + Plating
    (bending) Simple die
 image091.jpg
  1. C2680-H　t=0.2
  2. Cu-Ag plating (plating ahead)
  3. (blank) Die blanking
    (bending) Simple die
image063.jpg
  1. SPCC-1B　t=0.2
  2. Cu-Sn plating (post-plating)
  3. (blank) Microscopic Laser Processor
    (bending) Simple die + Standard die
 image099.jpg
  1. SPCC-D　t=0.3 
  2. Cu-Sn plating (post-plating) 
  3. (blank) Microscopic Laser Processor
 image081.jpg
  1. C5210-H　t=0.15 
  2. Cu-Sn plating (post-plating) 
  3. (blank) Microscopic Laser Processor
    (bending) Simple die
     
 image093.jpg
  1. C2680-H　t=0.4
  2. - 
  3. (blank) Die blanking
    (bending) Simple die, Caulking
image107.jpg
  1. C5210-H　t=0.2 
  2. -
  3. (blank) Etching
    (bending) Simple die
 image103.jpg
  1. C2680-1/2H　t=0.4
  2. -
  3. (blank) Wire EDM
    (bending) Simple die
 image105.jpg
  1. SECC　t=0.5
  2. -
  3. (blank) Microscopic Laser Processor
    (bending) Simple die
 image097.jpg
  1. KFC-1/2H　t=0.4
  2. Cu-Ag plating (post-plating)
  3. (blank) Die blanking
    (bending) Simple die + Standard die
image057.jpg
  1. SUS304CSP-H　t=0.15
  2. - 
  3. (blank) Etching
    (bending) Simple die + Standard die
 image059.jpg
  1. C2680-H　t=0.15
  2. Cu-Ag plating (plating ahead)
  3. (blank) Etching + Plating
    (bending) Simple die
 image111.jpg
  1. SUYP　t=1.5
  2. Cu-Ni plating (post-plating)
  3. (blank) Die blanking
    (bending) Simple die
 image109.jpg
  1. SUYP　t=1.2
  2. Cu-Ni plating (post-plating)
  3. Simple progressive
image119.jpg
  1. SUYP　t=1.0
  2. Cu-Ni plating (post-plating)
  3. (blank) Die blanking
    (bending) Simple die
    hemming
 image121.jpg
  1. SUYP　t=1.5
  2. Cu-Ni plating (post-plating)
  3. (blank) Die blanking
    (bending) Simple die
 image113.jpg
  1. SUS304CSP-H　t=0.1
  2.  -
  3. (blank) Die blanking
    (bending) Simple die
 image115.jpg
  1. C5210-EH　t=0.08 
  2. -
  3. (blank) Die blanking
    (bending) Simple die
image117.jpg
  1. C5191-H　t=0.2 
  2. -
  3. (blank) Die blanking
 image123.jpg
  1. C2801-1/4H　t=0.5
  2. -
  3. Simple progressive
 image125.jpg
  1. C5191-H　t=0.15<
  2. Cu-Ni plating (post-plating)
  3. (blank）Etching + Plating
    Simple progressive
  

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The Samples of Metal/Resin sets

Metal Part Ⅰ
Electronic ComponentsⅠ: Metal
Connectors, Relays, Switches, Motors, Antennas, etc.
Resin Parts Ⅱ
Electronic ComponentsⅡ: Resin
Housing, Base, Connectors, Switches, etc.
Metal Part Ⅲ
Electronic ComponentsⅢ

Lead Frames, Backlights, Power Modules, etc.

Metal Parts Ⅳ
Electronic ComponentsⅣ
Covers, Shield Cases, etc.
Drawing Processing
Drawing Parts
Circular Drawing, Square Drawing, Complex shaped Drawing, etc.
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Various Mechanical Parts
Vehicle Components, Industrial Machine Parts, etc.
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The Examples of Difficult Processing Products

Making Fins by Stamping
Fin Stamping
Offset Fins, Corrugated Fins, etc.
The Change of Method
No More Die Casting
Low-Costs, Weight-saving,etc.
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Suitable for a Need of Strength,etc.
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